• DocumentCode
    512198
  • Title

    Low cost camera modules using integration of wafer-scale optics and wafer-level packaging of image sensors

  • Author

    Han, Hongtao ; Main, Keith

  • Author_Institution
    Tessera North America, 9815 David Taylor Drive, Charlotte, NC, USA 28262
  • Volume
    2009-Supplement
  • fYear
    2009
  • fDate
    2-6 Nov. 2009
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Using wafer scale optics, wafer scale integration, and wafer level packaging of image sensor, we developed small form factor (3.3mm×3.3mm×2.5mm), low manufacturing cost, Pb-free solder reflow compatible digital camera modules which are suitable for many applications including mobile electronic devices, automotives, security, and medical applications.
  • Keywords
    Automotive engineering; Biomedical optical imaging; Costs; Digital cameras; Image sensors; Integrated optics; Manufacturing; Optical devices; Optical sensors; Wafer scale integration; Low Cost Camera; WLCSP; Wafer Bonding; Wafer Level Camera; Wafer Level Optics; Wafer Level Packaging; Wafer Scale Integration; Wafer Scale Optics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Communications and Photonics Conference and Exhibition (ACP), 2009 Asia
  • Conference_Location
    Shanghai, China
  • Print_ISBN
    978-1-55752-877-3
  • Electronic_ISBN
    978-1-55752-877-3
  • Type

    conf

  • Filename
    5405473
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=512198