DocumentCode
512285
Title
Investigation on the aging characteristics of high-power white LEDs under different stresses
Author
Yan, Jing ; Shang, Zhendong ; Chen, Jianxin
Author_Institution
Beijing Optoelectronic Technology Laboratory, Beijing University of Technology, 100124, China
Volume
2009-Supplement
fYear
2009
fDate
2-6 Nov. 2009
Firstpage
1
Lastpage
6
Abstract
We used two types of 1-W white LEDs, both of which had the structure of GaN chip with phosphor covered and packaged in metal PCB boards with laminated aluminum. Of the two types of packaging lens, one is made of hard silica gel, and the other is made of soft plastic. The purpose of this paper is to analyze the aging characters of high-power white LEDs under stresses. In accelerated life tests, the two types of white LEDs were treated with high temperature and DC current distinctively. The tendencies of the decay of luminous flux in the two conditions were basically the same, while the changing trends of the color temperature were different. The hard silica gel had better stability.
Keywords
Aging; Aluminum; Gallium nitride; Lenses; Light emitting diodes; Phosphors; Plastic packaging; Silicon compounds; Stress; Temperature; aging stresses; color temperature; high-power white LEDs; luminous output; reliability;
fLanguage
English
Publisher
ieee
Conference_Titel
Communications and Photonics Conference and Exhibition (ACP), 2009 Asia
Conference_Location
Shanghai, China
Print_ISBN
978-1-55752-877-3
Electronic_ISBN
978-1-55752-877-3
Type
conf
Filename
5405567
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