DocumentCode :
512671
Title :
Electrical characteristics of Hf-based GaAs MOS capacitors with thin HfOxNy interlayer
Author :
Das, T. ; Mahata, C. ; Dalapati, G.K. ; Chi, D.Z. ; Sutradhar, G. ; Bose, P.K. ; Maiti, C.K.
fYear :
2009
fDate :
14-16 Dec. 2009
Firstpage :
1
Lastpage :
4
Abstract :
Electrical and reliability characteristic of Hf-based GaAs metal-oxide-semiconductor (MOS) capacitors (TaN/HfO2/HfOxNy/p-GaAs) with ultrathin HfOxNy interfacial layer is investigated. Charge trapping behavior has been studied under both the DC and dynamic voltage stressing. Transient response and the degradation mechanism of the dielectric have been studied both under positive and negative DC gate bias stressing conditions. Effect of interfacial layer thickness variation on flat band voltage instability is reported. It is found that both the interface and bulk traps in gate stacks contribute significantly to flat band voltage instability of HfO2-based GaAs MOS capacitors. Both types of trapping are observed under dynamic stressing with the gate hole injections.
Keywords :
III-V semiconductors; MOS capacitors; dielectric thin films; gallium arsenide; hafnium compounds; interface states; semiconductor device reliability; tantalum compounds; transient response; DC voltage stressing; MOS capacitors; TaN-HfO2-HfOxNy-GaAs; bulk traps; charge trapping behavior; dielectric degradation mechanism; dynamic stressing; dynamic voltage stressing; electrical characteristic; flat band voltage instability; interface traps; metal-oxide-semiconductor capacitors; negative DC gate bias stressing condition; positive DC gate bias stressing condition; reliability characteristic; transient response; ultrathin interfacial layer; Capacitance-voltage characteristics; Dielectric substrates; Electric variables; Gallium arsenide; Hafnium oxide; MOS capacitors; Passivation; Plasma applications; Plasma temperature; Voltage; GaAs; HfOxNy; high-k gate dielectric; plasma nitridation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computers and Devices for Communication, 2009. CODEC 2009. 4th International Conference on
Conference_Location :
Kolkata
Print_ISBN :
978-1-4244-5073-2
Type :
conf
Filename :
5407238
Link To Document :
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