DocumentCode
512698
Title
Degradation-aware analog design flow for lifetime yield analysis and optimization
Author
Pan, Xin ; Graeb, Helmut
Author_Institution
Inst. for Electron. Design Autom., Tech. Univ. Muenchen, Munich, Germany
fYear
2009
fDate
13-16 Dec. 2009
Firstpage
667
Lastpage
670
Abstract
As integrated circuit technology scales down continuously, transistor parameters will shift from their nominal values due to process-induced variations and time-dependent degradations. While the former issue contributes directly to the production yield of the fresh circuit, the reliability issue will cause an additional yield loss during the lifetime. Thus the prediction of the circuit´s lifetime yield is highly necessary early in the design phase. Considering both process variation and lifetime degradation together, this paper presents a novel framework to analyze and optimize the lifetime yield value based on worst-case distances using exemplary state of the art reliability simulator and design centering software.
Keywords
analogue integrated circuits; circuit CAD; circuit optimisation; integrated circuit design; integrated circuit reliability; circuit lifetime yield; degradation-aware analog design flow; design centering software; integrated circuit technology; lifetime degradation; lifetime yield analysis; optimization; process-induced variations; reliability; time-dependent degradations; transistor parameters; Algorithm design and analysis; Analog integrated circuits; Analytical models; Circuit simulation; Degradation; Design optimization; Integrated circuit yield; Manufacturing processes; Performance analysis; Software design;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics, Circuits, and Systems, 2009. ICECS 2009. 16th IEEE International Conference on
Conference_Location
Yasmine Hammamet
Print_ISBN
978-1-4244-5090-9
Electronic_ISBN
978-1-4244-5091-6
Type
conf
DOI
10.1109/ICECS.2009.5410811
Filename
5410811
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