• DocumentCode
    512698
  • Title

    Degradation-aware analog design flow for lifetime yield analysis and optimization

  • Author

    Pan, Xin ; Graeb, Helmut

  • Author_Institution
    Inst. for Electron. Design Autom., Tech. Univ. Muenchen, Munich, Germany
  • fYear
    2009
  • fDate
    13-16 Dec. 2009
  • Firstpage
    667
  • Lastpage
    670
  • Abstract
    As integrated circuit technology scales down continuously, transistor parameters will shift from their nominal values due to process-induced variations and time-dependent degradations. While the former issue contributes directly to the production yield of the fresh circuit, the reliability issue will cause an additional yield loss during the lifetime. Thus the prediction of the circuit´s lifetime yield is highly necessary early in the design phase. Considering both process variation and lifetime degradation together, this paper presents a novel framework to analyze and optimize the lifetime yield value based on worst-case distances using exemplary state of the art reliability simulator and design centering software.
  • Keywords
    analogue integrated circuits; circuit CAD; circuit optimisation; integrated circuit design; integrated circuit reliability; circuit lifetime yield; degradation-aware analog design flow; design centering software; integrated circuit technology; lifetime degradation; lifetime yield analysis; optimization; process-induced variations; reliability; time-dependent degradations; transistor parameters; Algorithm design and analysis; Analog integrated circuits; Analytical models; Circuit simulation; Degradation; Design optimization; Integrated circuit yield; Manufacturing processes; Performance analysis; Software design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics, Circuits, and Systems, 2009. ICECS 2009. 16th IEEE International Conference on
  • Conference_Location
    Yasmine Hammamet
  • Print_ISBN
    978-1-4244-5090-9
  • Electronic_ISBN
    978-1-4244-5091-6
  • Type

    conf

  • DOI
    10.1109/ICECS.2009.5410811
  • Filename
    5410811