DocumentCode
512706
Title
Solutions to optoelectronic interconnect problems
Author
Kumpatla, S. ; Casswell, J.J. ; Snowdon, J.F.
Author_Institution
Optically Interconnected Comput. Group, Heriot-Watt Univ., Edinburgh, UK
fYear
2005
fDate
6-8 June 2005
Firstpage
1
Lastpage
3
Abstract
Optoelectronic bonding has been performed onto sample MCMs, which are to be used for optical testing on HOLMS demonstrator. The photodiodes and VCSELs were successfully bonded, but we experienced problems attaching the Mixed Signal chips.
Keywords
bonding processes; integrated optoelectronics; multichip modules; optical interconnections; photodiodes; surface emitting lasers; HOLMS demonstrator; MCM; VCSEL; mixed signal chips; multichip modules; optical testing; optoelectronic bonding; optoelectronic interconnect; photodiodes; Bonding; Flip chip; Gold; High speed optical techniques; Metallization; Optical interconnections; Oxidation; Photodiodes; Testing; Vertical cavity surface emitting lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Information Photonics, 2005. IP 2005. OSA Topical Meeting on
Conference_Location
Charlotte, NC
Print_ISBN
978-1-4244-6637-5
Type
conf
Filename
5411868
Link To Document