Title :
Solutions to optoelectronic interconnect problems
Author :
Kumpatla, S. ; Casswell, J.J. ; Snowdon, J.F.
Author_Institution :
Optically Interconnected Comput. Group, Heriot-Watt Univ., Edinburgh, UK
Abstract :
Optoelectronic bonding has been performed onto sample MCMs, which are to be used for optical testing on HOLMS demonstrator. The photodiodes and VCSELs were successfully bonded, but we experienced problems attaching the Mixed Signal chips.
Keywords :
bonding processes; integrated optoelectronics; multichip modules; optical interconnections; photodiodes; surface emitting lasers; HOLMS demonstrator; MCM; VCSEL; mixed signal chips; multichip modules; optical testing; optoelectronic bonding; optoelectronic interconnect; photodiodes; Bonding; Flip chip; Gold; High speed optical techniques; Metallization; Optical interconnections; Oxidation; Photodiodes; Testing; Vertical cavity surface emitting lasers;
Conference_Titel :
Information Photonics, 2005. IP 2005. OSA Topical Meeting on
Conference_Location :
Charlotte, NC
Print_ISBN :
978-1-4244-6637-5
