DocumentCode
513551
Title
Design and evaluation of controlled impedance PCBs for high frequency applications
Author
James, M.P. ; Achutananda, N. ; Rao, K. Nageswara ; Nanjundaswamy, TS
Author_Institution
Syst. Reliability Group, ISRO Satellite Centre, Banaglore, India
fYear
2006
fDate
23-24 Feb. 2006
Firstpage
25
Lastpage
30
Abstract
Operating speeds of data handling systems for onboard spacecraft applications are ever increasing so as to meet the performance requirements like high resolution, stereoscopic imaging etc., of complex remote sensing payloads. In such applications, the Printed Circuit Boards (PCBs) used for realization of hardware are not simple interconnection platforms only, but are required to provide matched impedance interconnections between devices. They are required to include physical circuit configurations that have characteristic impedance with close tolerances as per the required design. This paper discusses the involved process in design, analysis and evaluation of such printed circuit boards. It uses the model suggested in the IPC 2141 document for conducting a sensitivity analysis of characteristic impedance as a function of process parameters. It discusses the production flow in a practical situation for a design up to 350 Mbps LVDS signals. Practically realized parameters have shown an excellent match with the design requirements and the system performance has met all the functional requirements.
Keywords
data handling; high-speed integrated circuits; printed circuits; remote sensing; IPC 2141 document; LVDS signals; PCB; data handling systems; impedance interconnections; onboard spacecraft; physical circuit configurations; printed circuit boards; remote sensing payloads; sensitivity analysis; Data handling; Frequency; High-resolution imaging; Image resolution; Impedance; Integrated circuit interconnections; Payloads; Printed circuits; Remote sensing; Space vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
ElectroMagnetic Interference and Compatibility (INCEMIC), 2006 Proceedings of the 9th International Conference on
Conference_Location
Bangalore
Print_ISBN
978-1-4244-5203-3
Type
conf
Filename
5419659
Link To Document