DocumentCode :
513815
Title :
A New Multichip Package for Telecommunication Application
Author :
Lee, Y.M. ; Jang, D.H. ; Sun, Y.B.
Author_Institution :
Package Development, Samsung Electronics Co., Kiheung, Korea
fYear :
1995
fDate :
25-27 Sept. 1995
Firstpage :
817
Lastpage :
818
Keywords :
Application specific integrated circuits; Costs; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Plastic integrated circuit packaging; Plastic packaging; Sun; Testing; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1995. ESSDERC '95. Proceedings of the 25th European
Conference_Location :
The Hague, The Netherlands
Print_ISBN :
286332182X
Type :
conf
Filename :
5436143
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=513815
بازگشت