The Protection Chips from External Mechanical Loads in Microelectronic Products

Author

Malicheva, T.V. ; Shulgov, V.V.

fYear

1995

fDate

25-27 Sept. 1995

Firstpage

819

Lastpage

821

Keywords

Conducting materials; Damping; Degradation; Dielectric materials; Glass; Inorganic materials; Microelectronics; Moisture; Protection; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid State Device Research Conference, 1995. ESSDERC '95. Proceedings of the 25th European

Conference_Location

The Hague, The Netherlands

Print_ISBN

286332182X

Type

Filename

5436144

Link To Document