Title :
The Protection Chips from External Mechanical Loads in Microelectronic Products
Author :
Malicheva, T.V. ; Shulgov, V.V.
Keywords :
Conducting materials; Damping; Degradation; Dielectric materials; Glass; Inorganic materials; Microelectronics; Moisture; Protection; Temperature;
Conference_Titel :
Solid State Device Research Conference, 1995. ESSDERC '95. Proceedings of the 25th European
Conference_Location :
The Hague, The Netherlands
