• DocumentCode
    513871
  • Title

    Low Dielectric Constant Spin-on-Polymers for Interlayer Dielectric Applications

  • Author

    Sun, S.C. ; Chuang, Y.C.

  • Author_Institution
    National Nano Device Laboratory, National Chiao Tung University, Hsinchu, Taiwan, R.O.C.
  • fYear
    1996
  • fDate
    9-11 Sept. 1996
  • Firstpage
    101
  • Lastpage
    104
  • Abstract
    This paper will present the characterization results of two low dielectric constant methylsilsesquioxane spin-on polymers and a conventional siloxane SOG. The chemical bonding structure, thermal stability, stress-temperature variations and the leakage current will be examined.
  • Keywords
    Bonding; Chemicals; Curing; Dielectric constant; Dielectric materials; Dielectric measurements; Leakage current; Polymer films; Sun; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 1996. ESSDERC '96. Proceedings of the 26th European
  • Conference_Location
    Bologna, Italy
  • Print_ISBN
    286332196X
  • Type

    conf

  • Filename
    5436229