DocumentCode
513900
Title
Device Design Issues for a High-Performance Bipolar Technology with Si or SiGe Epitaxial Base
Author
Burghartz, J.N. ; Cressler, J.D. ; Jenkins, K.A. ; Sun, J.Y.-C. ; Stork, J.M.C. ; Comfort, J.H. ; Brunner, T.A. ; Stanis, C.L.
Author_Institution
IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, New York, 10598, FAX: (914)945-2141
fYear
1991
fDate
16-19 Sept. 1991
Firstpage
11
Lastpage
14
Abstract
Design issues for a high-performance bipolar technology with Si or SiGe epitaxial base are discussed. Narrow and shallow polysilicon emitter formation and extrinsic base design for low base resistance are investigated using selective epitaxy emitter window (SEEW) transistors. In spite of a close proximity of the extrinsic base diffusion to the intrinsic device a cut-off frequency (fT ) up to 50 GHz has been achieved for an emitter width of 0.35 ¿m. The depth of the extrinsic base diffusion did affect the collector-base capacitance and indicated that the extrinsic base should be designed in a manner consistent with the circuit operating current density. Further, we discuss in detail the emitter window tolerance for SEEW formation.
Keywords
Contact resistance; Current density; Cutoff frequency; Delay; Epitaxial growth; Etching; Germanium silicon alloys; Implants; Lithography; Silicon germanium;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Device Research Conference, 1991. ESSDERC '91. 21st European
Conference_Location
Montreux, Switzerland
Print_ISBN
0444890661
Type
conf
Filename
5436262
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