• DocumentCode
    513900
  • Title

    Device Design Issues for a High-Performance Bipolar Technology with Si or SiGe Epitaxial Base

  • Author

    Burghartz, J.N. ; Cressler, J.D. ; Jenkins, K.A. ; Sun, J.Y.-C. ; Stork, J.M.C. ; Comfort, J.H. ; Brunner, T.A. ; Stanis, C.L.

  • Author_Institution
    IBM Research Division, Thomas J. Watson Research Center, Yorktown Heights, New York, 10598, FAX: (914)945-2141
  • fYear
    1991
  • fDate
    16-19 Sept. 1991
  • Firstpage
    11
  • Lastpage
    14
  • Abstract
    Design issues for a high-performance bipolar technology with Si or SiGe epitaxial base are discussed. Narrow and shallow polysilicon emitter formation and extrinsic base design for low base resistance are investigated using selective epitaxy emitter window (SEEW) transistors. In spite of a close proximity of the extrinsic base diffusion to the intrinsic device a cut-off frequency (fT) up to 50 GHz has been achieved for an emitter width of 0.35 ¿m. The depth of the extrinsic base diffusion did affect the collector-base capacitance and indicated that the extrinsic base should be designed in a manner consistent with the circuit operating current density. Further, we discuss in detail the emitter window tolerance for SEEW formation.
  • Keywords
    Contact resistance; Current density; Cutoff frequency; Delay; Epitaxial growth; Etching; Germanium silicon alloys; Implants; Lithography; Silicon germanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 1991. ESSDERC '91. 21st European
  • Conference_Location
    Montreux, Switzerland
  • Print_ISBN
    0444890661
  • Type

    conf

  • Filename
    5436262