• DocumentCode
    513922
  • Title

    Coupling of different leakage paths between trench capacitors

  • Author

    Bergner, W. ; Kircher, R.

  • Author_Institution
    ZFE SPT 33, SIEMENS AG, Otto-Hahn-Ring 6, D.8000 Munich 83, Germany, Tel. (+4989) 636-45782.
  • fYear
    1990
  • fDate
    10-13 Sept. 1990
  • Firstpage
    469
  • Lastpage
    472
  • Abstract
    Out from various cell concepts under investigation for the 16 and 64 Megabit DRAM generation the depletic type trench cell is still favoured because of its low process complexity. However, further shrinking of this cell concept, which is been widely used for the 4 Megabit DRAM, may result in leakage problems between neighbouring trench capacitors. The isolation of a modified version of this cell type, the SSP cell, has been investigated by numerical simulation as a function of well implantation dose and the trench to trench separation in the case of three closely spaced trench capacitors.
  • Keywords
    Boron; Breakdown voltage; Capacitors; Doping profiles; Geometry; Numerical analysis; Numerical simulation; Random access memory; Shape; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 1990. ESSDERC '90. 20th European
  • Conference_Location
    Nottingham, England
  • Print_ISBN
    0750300655
  • Type

    conf

  • Filename
    5436314