DocumentCode :
513938
Title :
Temperature non-uniformities in a silicon test square during rapid thermal processing
Author :
O´Neill, A.G. ; Boys, D ; Jones, S K ; Hill, C.
Author_Institution :
Department of Electrical and Electronic Engineering, University of Newcastle upon Tyne, NEI 7RU, UK
fYear :
1990
fDate :
10-13 Sept. 1990
Firstpage :
69
Lastpage :
72
Abstract :
Rapid thermal processing of a small process square placed on a susceptor wafer of controlled emissivity is investigated. Under these conditions the process square is hotter than the susceptor wafer. Finite element modelling is compared with experimental data and used to predict the subsequently observed changes in process square temperature as its size and the condition of the susceptor wafer are changed.
Keywords :
Finite element methods; Partial differential equations; Rapid thermal processing; Semiconductor device modeling; Silicon; System testing; Temperature control; Temperature distribution; Temperature measurement; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1990. ESSDERC '90. 20th European
Conference_Location :
Nottingham, England
Print_ISBN :
0750300655
Type :
conf
Filename :
5436400
Link To Document :
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