DocumentCode :
514097
Title :
Comparison of 11.5 μm2 Stacked Capacitor and Trench Capacitor Cells in Mbit Test Mnmory
Author :
Risch, L. ; Sesselmann, W. ; Tielert, R.
Author_Institution :
Siemens AG, Central Research and Development, ME23, Otto Hahn Ring 6, 8 Munich 83, FRG
fYear :
1987
fDate :
14-17 Sept. 1987
Firstpage :
757
Lastpage :
760
Abstract :
A 1Mbit DRAM testcircuit with stacked capacitor or alternatively with trench capacitor cells has been fabricated in 4Mbit design rules and technology. The smaller capacitances obtained by the stacked capacitor at same cell sizes is compensated by reduced leakage currents and α-particle sensitivity. Both cells need a cell voltage of 5V for reliable operation.
Keywords :
Capacitance; Capacitors; Dielectrics; Doping; Geometry; Leakage current; Random access memory; Testing; Topology; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1987. ESSDERC '87. 17th European
Conference_Location :
Bologna, Italy
Print_ISBN :
0444704779
Type :
conf
Filename :
5436745
Link To Document :
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