DocumentCode :
514102
Title :
Oxygen Implantation for SOI Device Technologies
Author :
Yallup, Kevin ; De Veirman, An ; Dupas, Luc ; De Meyer, Kristin
Author_Institution :
Analog Devices, c/o IMEC Kapeldreef 75, B-3030 Leuven
fYear :
1987
fDate :
14-17 Sept. 1987
Firstpage :
521
Lastpage :
524
Abstract :
In this work the formation of silicon on insulator (SOI) substrates by oxygen implantation (SIMOX) and annealing followed by an epitaxial deposition step will be described. Physical results for the material will be presented and then the corresponding electrical parameters will be discussed and compared with those obtained from bulk wafers processed simultaneously. From the results described we hope to indicate the areas in which problems are likely to occur when using such substrates in an IC process.
Keywords :
Annealing; CMOS process; Hafnium; Heat treatment; Nitrogen; Oxygen; Protection; Silicon on insulator technology; Substrates; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid State Device Research Conference, 1987. ESSDERC '87. 17th European
Conference_Location :
Bologna, Italy
Print_ISBN :
0444704779
Type :
conf
Filename :
5436751
Link To Document :
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