T/R-module technologies today and possible evolutions

After many years of development the active electronically scanned array (AESA) radar technology reached a mature technology level. Many of today´s and future radar systems will be equipped with the ASEA technology. T/R-modules are key elements in active phased array antennas for radar and electronic warfare applications. Meanwhile T/R-modules using GaAs MMICs are in mass production with high quantities. Top priority is on continuous improvement of yield figures by optimizing the spread of key performance parameters to come down with cost. To fulfill future demands on power, bandwidth, robustness, weight, multifunctional sensor capability, and overall sensor cost, new emerging semiconductor and packaging technologies have to be implemented for the next generation T/R-modules. Using GaN MMICs as HPAs and also as robust LNAs is a promising approach. Higher integration at the amplitude and phase setting section of the T/R-module is realized with GaAs core chips or even with SiGe multifunction chips. With increasing digital signal processing capability the digital beam forming will get more importance with a high impact on the T/R-modules. For lower production costs but also for sensor integration new packaging concepts are necessary. This includes the transition towards organic packages or the transition from brick style T/R-module to a tile T/R-module.