DocumentCode
515659
Title
The transition to chip-level optical interconnects
Author
Haney, Michael W. ; Sparacin, Daniel K. ; Hodiak, Justin
Author_Institution
Defense Adv. Res. Projects Agency, Arlington, VA, USA
fYear
2010
fDate
21-25 March 2010
Firstpage
1
Lastpage
3
Abstract
The increasing bandwidth demands of computing chips have spawned significant research into chip-scale photonic interconnects. We review the DARPA-sponsored efforts at the inter- and intra-chip interconnect levels and highlight the key challenges to be addressed.
Keywords
integrated optics; optical computing; optical interconnections; bandwidth demands; chip-level optical interconnects; chip-scale photonic interconnects; interchip interconnect level; intrachip interconnect level; photonic integrated circuit technologies; Bandwidth; Fabrics; Integrated circuit interconnections; Integrated circuit technology; Optical fiber communication; Optical interconnections; Optical signal processing; Optical waveguides; Packaging; Photonic integrated circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Fiber Communication (OFC), collocated National Fiber Optic Engineers Conference, 2010 Conference on (OFC/NFOEC)
Conference_Location
San Diego, CA
Electronic_ISBN
978-1-55752-884-1
Type
conf
Filename
5465368
Link To Document