Title :
Sensor Design and Fabrication for Cointegration with Circuitry
Author_Institution :
Physical Electronics Laboratory, ETH Zurich, CH-8093 Zurich, Switzerland
Abstract :
Sensor design and fabrication compatible with standard IC technologies has the advantages of on-chip signal conditioning circuitry and cost-effective batch fabrication. Thermomechanical microsensors realized by industrial CMOS or bipolar IC technology with IC-compatible postprocessing micromachining or deposition steps are presented. Examples include resistive and thermoelectric gas flow sensors, capacitive moisture sensors, and a thermally excited beam resonator.
Keywords :
Bipolar integrated circuits; CMOS integrated circuits; CMOS technology; Capacitive sensors; Fabrication; Gas detectors; Microsensors; Signal design; Thermal sensors; Thermomechanical processes;
Conference_Titel :
Solid-State Circuits Conference, 1991. ESSCIRC '91. Proceedings - Seventeenth European
Conference_Location :
Milan, Italy
