Title :
Minimizing Mixed-Signal Coupling and Interaction
Author :
Schmerbeck, Timothy J.
Author_Institution :
IBM, AS/400 & Storage Systems Division, Rochester, Minnesota, U.S.A
Abstract :
This paper surveys techniques and strategies aimed at minimizing electro-magnetic coupling and interaction on mixed-signal IC´s. Consideration is given to substrate coupling, power rail and i/o driver resonances, near field capacitive and inductive as well as package interaction and module level radiated emissions.
Keywords :
Circuit noise; Coupling circuits; Integrated circuit noise; Integrated circuit packaging; Low-frequency noise; Noise generators; Noise level; Semiconductor device noise; Substrates; Switching circuits;
Conference_Titel :
Solid-State Circuits Conference, 1994. ESSCIRC '94. Twentieth European
Conference_Location :
Ulm, Germany
Print_ISBN :
2-86332-160-9
