• DocumentCode
    5168
  • Title

    On the Origin of Kink Effect in Current–Voltage Characteristics of AlGaN/GaN High Electron Mobility Transistors

  • Author

    Kaushik, Janesh K. ; Balakrishnan, V. Raman ; Panwar, B.S. ; Muralidharan, Ramal

  • Author_Institution
    Solid State Phys. Lab., New Delhi, India
  • Volume
    60
  • Issue
    10
  • fYear
    2013
  • fDate
    Oct. 2013
  • Firstpage
    3351
  • Lastpage
    3357
  • Abstract
    An explanation for the observed drain current collapse in AlGaN/GaN high electron mobility transistors is presented. The drain current-voltage (I-V) characteristics which show this undesirable behavior have been modeled using the physics-based ATLAS device simulator by Silvaco. A basic theory for the determination of virtual gate length for a three terminal device has been developed and used in the simulation. The simulated I-V characteristics closely match the experimental results. This paper suggests a model based on formation of a high resistance region under the virtual gate in the 2-D electron gas channel. The resistance of this region changes abruptly at a critical lateral electric field due to application of drain-source voltage. This abrupt change has been found to be a function of channel temperature. The dynamic behavior of this high resistance region has been proposed to be the cause of drain current collapse.
  • Keywords
    III-V semiconductors; aluminium compounds; circuit simulation; electric resistance; gallium compounds; high electron mobility transistors; two-dimensional electron gas; wide band gap semiconductors; 2D electron gas channel; AlGaN-GaN; I-V characteristics; Silvaco; channel temperature; critical lateral electric field; current-voltage characteristics; drain current collapse; drain current-voltage; drain-source voltage; dynamic behavior; high electron mobility transistors; high resistance region; kink effect; physics-based ATLAS device simulator; region resistance; terminal device; virtual gate length; Aluminum gallium nitride; Electron traps; Gallium nitride; HEMTs; Logic gates; Resistance; Temperature measurement; AlGaN/GaN high electron mobility transistor (HEMT); drain current collapse; trap assisted tunneling; virtual gate length;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2013.2279158
  • Filename
    6595562