• DocumentCode
    518050
  • Title

    Notice of Retraction
    The study of FEM model for micro-milling cutting performance

  • Author

    Lin, W.Y. ; Zheng, Y.H. ; Lee, B.Y.

  • Author_Institution
    Dept. of Mech. & Comput.-Aided Eng., Nat. Formosa Univ., Huwei, Taiwan
  • Volume
    2
  • fYear
    2010
  • fDate
    16-18 April 2010
  • Abstract
    Notice of Retraction

    After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.

    We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.

    The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.

    This paper applied DEFORM software to construct a 2-D analysis model of micro-cutting SKD61 mold steel, by utilizing local grid to distinguish the shear zone between material and chips so that the grid could show a certain amount of quadrilaterals. Then, different cutting conditions were experimented to simulate orthogonal cutting and change the tool geometry (rake angle and relief angle), cutting velocity and cutting depth, and failure criteria were utilized to simulate material fracture. Lastly, FEM model was employed to simulate chip formation in micro-cutting, and the result was consistent with the actual milling. Therefore, the micro-cutting model constructed by FEM model could be used to perform micro-milling performance analysis.
  • Keywords
    cutting; finite element analysis; fracture; milling; 2D analysis model; DEFORM software; FEM model; material fracture; micromilling cutting performance; orthogonal cutting; shear zone; Building materials; Deformable models; Geometry; Milling; Performance analysis; Solid modeling; Steel; Finite Element Analysis; Micro-milling; SKD61 Mold Steel;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Engineering and Technology (ICCET), 2010 2nd International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-6347-3
  • Type

    conf

  • DOI
    10.1109/ICCET.2010.5485520
  • Filename
    5485520