DocumentCode :
518528
Title :
Static and dynamic mechanical properties measurement of micro-nano metal thin film using cantilever beam deflection
Author :
Cheng, Ya-Chi ; Lin, Ming-Tzer ; Chen, Peng Chih ; Tong, Chi-Jia
Author_Institution :
Inst. of Precision Eng., Nat. Chung Hsing Univ., Taichung, Taiwan
fYear :
2010
fDate :
5-7 May 2010
Firstpage :
203
Lastpage :
208
Abstract :
A technique for studying the mechanical behavior of thin metal films is presented. The test specimen was designed to deposit on a novel triangle shape “paddle” beam in order to provide uniform plane strain distribution. Standard clean room processing was used to prepare the sample. The experiments were operated by using the electrostatic deflection on the “paddle” cantilever beam and measure the thin films on top by laser reflected into the position sensor. The measured strain was converted through a simple geometry calculation for the deflection of the cantilever. The static testing results on the Young´s modulus of different thickness Al films were obtained in this research. The dynamic properties of thin film were also studied using the dynamic frequency response of the paddle structure generated by electrostatic force under different vacuum pressure. The results indicated the vacuum pressure affect the paddle sample free damping time. In addition, loss mechanism of dynamic response gives potential evidences of grain boundary motion or dislocation motion in the film.
Keywords :
Young´s modulus; aluminium; beams (structures); cantilevers; dislocation motion; dynamic response; electrostatic devices; frequency response; geometry; grain boundaries; internal stresses; metallic thin films; micromechanical devices; strain measurement; Al; Young´s modulus; cantilever beam deflection; dislocation motion; dynamic frequency response; dynamic properties; geometry calculation; grain boundary motion; micro-nano metal thin film; static-dynamic mechanical properties measurement; triangle shape paddle beam; uniform plane strain distribution; Electrostatic measurements; Laser beams; Mechanical factors; Mechanical variables measurement; Shape; Strain measurement; Structural beams; Testing; Thin film sensors; Transistors; dynamic behavior; mechanical behavior; paddle cantilever beam; thin films;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on
Conference_Location :
Seville
Print_ISBN :
978-1-4244-6636-8
Electronic_ISBN :
978-2-35500-011-9
Type :
conf
Filename :
5486445
Link To Document :
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