• DocumentCode
    518528
  • Title

    Static and dynamic mechanical properties measurement of micro-nano metal thin film using cantilever beam deflection

  • Author

    Cheng, Ya-Chi ; Lin, Ming-Tzer ; Chen, Peng Chih ; Tong, Chi-Jia

  • Author_Institution
    Inst. of Precision Eng., Nat. Chung Hsing Univ., Taichung, Taiwan
  • fYear
    2010
  • fDate
    5-7 May 2010
  • Firstpage
    203
  • Lastpage
    208
  • Abstract
    A technique for studying the mechanical behavior of thin metal films is presented. The test specimen was designed to deposit on a novel triangle shape “paddle” beam in order to provide uniform plane strain distribution. Standard clean room processing was used to prepare the sample. The experiments were operated by using the electrostatic deflection on the “paddle” cantilever beam and measure the thin films on top by laser reflected into the position sensor. The measured strain was converted through a simple geometry calculation for the deflection of the cantilever. The static testing results on the Young´s modulus of different thickness Al films were obtained in this research. The dynamic properties of thin film were also studied using the dynamic frequency response of the paddle structure generated by electrostatic force under different vacuum pressure. The results indicated the vacuum pressure affect the paddle sample free damping time. In addition, loss mechanism of dynamic response gives potential evidences of grain boundary motion or dislocation motion in the film.
  • Keywords
    Young´s modulus; aluminium; beams (structures); cantilevers; dislocation motion; dynamic response; electrostatic devices; frequency response; geometry; grain boundaries; internal stresses; metallic thin films; micromechanical devices; strain measurement; Al; Young´s modulus; cantilever beam deflection; dislocation motion; dynamic frequency response; dynamic properties; geometry calculation; grain boundary motion; micro-nano metal thin film; static-dynamic mechanical properties measurement; triangle shape paddle beam; uniform plane strain distribution; Electrostatic measurements; Laser beams; Mechanical factors; Mechanical variables measurement; Shape; Strain measurement; Structural beams; Testing; Thin film sensors; Transistors; dynamic behavior; mechanical behavior; paddle cantilever beam; thin films;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on
  • Conference_Location
    Seville
  • Print_ISBN
    978-1-4244-6636-8
  • Electronic_ISBN
    978-2-35500-011-9
  • Type

    conf

  • Filename
    5486445