• DocumentCode
    518541
  • Title

    Investigation of parallel heat-flow path in electro-thermal microsystems

  • Author

    Szabó, Péter G. ; Székely, Vladimír

  • Author_Institution
    Dept. of Electron Devices, Budapest Univ. of Technol. & Econ. (BME), Budapest, Hungary
  • fYear
    2010
  • fDate
    5-7 May 2010
  • Firstpage
    215
  • Lastpage
    220
  • Abstract
    Due to the miniaturization seen in the last decades, several macro models that neglect parameters have to be revised in order to evaluate the behavior of different types of microsystems. In this paper we present the analysis of one such parameter which affects the thermal functionality, namely, the convection of natural gases. In macro scale this parameter is usually neglected, because the conductivity of gases is several magnitude smaller than that of the base materials. With the advance of microfabrication really good thermal isolation can be achieved and so their values can be evenly compared and the models have to be revised. This effect can be easily modeled on microstructures whose thermal resistance can be compared to the thermal conductivity of natural gases and whose output is temperature dependent. For this purpose different types of cantilevers with embedded thermopiles and heating resistors were used. The modeling and experimental results show that in microsystems that are sensitive to temperature change, the parallel heat flow created by the surrounding gases have significant impact on the operation.
  • Keywords
    convection; heat transfer; microfabrication; micromechanical devices; thermal conductivity; thermal resistance; electrothermal microsystems; microfabrication; natural gas convection; parallel heat-flow path; thermal functionality; thermal isolation; thermal resistance; Atmospheric modeling; Conducting materials; Electrostatics; Gases; Microstructure; Resistance heating; Temperature sensors; Thermal conductivity; Thermal resistance; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on
  • Conference_Location
    Seville
  • Print_ISBN
    978-1-4244-6636-8
  • Electronic_ISBN
    978-2-35500-011-9
  • Type

    conf

  • Filename
    5486460