• DocumentCode
    518565
  • Title

    Advances in the design and test of a novel open ended microwave oven

  • Author

    Pavuluri, Sumanth K. ; Tilford, Tim ; Goussetis, George ; Desmulliez, Marc P Y ; Ferenets, Marju ; Adamietz, Raphael ; Eicher, Frank ; Bailey, Chris

  • Author_Institution
    Microsyst. Eng. Centre (MISEC), Heriot-Watt Univ., Edinburgh, UK
  • fYear
    2010
  • fDate
    5-7 May 2010
  • Firstpage
    247
  • Lastpage
    252
  • Abstract
    An enhanced open ended waveguide cavity oven is presented with improved uniform heating, heating rates and power conversion efficiency. This next generation oven produces more uniform EM fields in the evanescent region forming part of the heating area of the oven. These fields are vital for the rapid and uniform heating of various electromagnetically lossy materials. A fibre optic temperature sensor is used to measure in situ and in real-time the temperature of the curing materials. An automatic computer controlled closed feedback loop measures the temperature in the curing material and drives the microwave components to obtain predetermined curing temperature cycles for efficient curing. Uniform curing of the lossy encapsulants is achieved with this oven with typical cure cycle of 270 seconds with a ramp rate of 1°C/s and a hold period of 2 minutes. Differential scanning calorimeter based measurement for the pulsed microwave based curing of the polymer dielectric indicates an 98% degree of cure.
  • Keywords
    curing; dielectric materials; differential scanning calorimetry; electromagnetic fields; fibre optic sensors; micromechanical devices; microwave ovens; waveguides; EM field; automatic computer controlled closed feedback loop; curing material; differential scanning calorimeter; electromagnetically lossy material; fibre optic temperature sensor; forming; heating area; heating rate; lossy encapsulant; microwave component; open ended microwave oven; open ended waveguide cavity oven; polymer dielectric; power conversion efficiency; pulsed microwave based curing; uniform curing; uniform heating; Curing; Electromagnetic heating; Electromagnetic measurements; Microwave measurements; Microwave ovens; Optical losses; Optical materials; Temperature measurement; Temperature sensors; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on
  • Conference_Location
    Seville
  • Print_ISBN
    978-1-4244-6636-8
  • Electronic_ISBN
    978-2-35500-011-9
  • Type

    conf

  • Filename
    5486495