DocumentCode
518569
Title
A study of package effects on the behavior of MEMS convective accelerometers
Author
Rekik, A.A. ; Azais, F. ; Dumas, N. ; Masmoudi, M. ; Mailly, F. ; Nouet, P.
Author_Institution
LIRMM, Univ. Montpellier 2, Montpellier, France
fYear
2010
fDate
5-7 May 2010
Firstpage
6
Lastpage
9
Abstract
In this paper, we investigate the impact of packaging on the behavior of MEMS convective accelerometers. The objective is to identify the influence of package dimensions on system performances to develop in a close future a compact model that integrates those influences. Experiments are based on FEM simulations and results are discussed with respect to the package height, the package shape and the depth of the bottom cavity.
Keywords
accelerometers; finite element analysis; microsensors; FEM simulations; MEMS; convective accelerometers; package dimensions; package effects; Acceleration; Accelerometers; Detectors; Mathematical model; Micromechanical devices; Packaging; Sensor phenomena and characterization; Sensor systems; Temperature sensors; Voltage; MEMS; convective accelerometer; package influence;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on
Conference_Location
Seville
Print_ISBN
978-1-4244-6636-8
Electronic_ISBN
978-2-35500-011-9
Type
conf
Filename
5486499
Link To Document