Title :
A study of package effects on the behavior of MEMS convective accelerometers
Author :
Rekik, A.A. ; Azais, F. ; Dumas, N. ; Masmoudi, M. ; Mailly, F. ; Nouet, P.
Author_Institution :
LIRMM, Univ. Montpellier 2, Montpellier, France
Abstract :
In this paper, we investigate the impact of packaging on the behavior of MEMS convective accelerometers. The objective is to identify the influence of package dimensions on system performances to develop in a close future a compact model that integrates those influences. Experiments are based on FEM simulations and results are discussed with respect to the package height, the package shape and the depth of the bottom cavity.
Keywords :
accelerometers; finite element analysis; microsensors; FEM simulations; MEMS; convective accelerometers; package dimensions; package effects; Acceleration; Accelerometers; Detectors; Mathematical model; Micromechanical devices; Packaging; Sensor phenomena and characterization; Sensor systems; Temperature sensors; Voltage; MEMS; convective accelerometer; package influence;
Conference_Titel :
Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on
Conference_Location :
Seville
Print_ISBN :
978-1-4244-6636-8
Electronic_ISBN :
978-2-35500-011-9
