• DocumentCode
    518590
  • Title

    Design of a co-integrated CMOS/NEMS oscillator with a simple electronic circuit

  • Author

    Arndt, Gregory ; Colinet, Eric ; Juillard, Jerome

  • Author_Institution
    CEA-LETI MINATEC, Grenoble, France
  • fYear
    2010
  • fDate
    5-7 May 2010
  • Firstpage
    368
  • Lastpage
    371
  • Abstract
    This paper presents the theoretical study of a monolithically integrated NEMS/CMOS oscillator with electrostatic actuation and piezoresistive detection. A feedback circuit based on a single active transistor is implemented. The proposed architecture is so compact that it can be implemented with ease in a sensor array application for example. A brief description of the NEMS resonator is given and the conditions for oscillation build-up are stated. We show how the co-integration allows the use of a very simple sustaining electronic circuit. This paper focuses on the determination of the system steady-state and more specifically the amplitude of the mechanical displacement and electronic output voltage. We show that the intrinsic nonlinearities of the electronic circuit can be used to achieve stable oscillation. The proposed oscillator exhibits a large output signal while keeping small mechanical amplitude compared to the electrostatic gap.
  • Keywords
    CMOS integrated circuits; electrostatic actuators; integrated circuit design; micromechanical resonators; nanoelectromechanical devices; oscillators; piezoresistive devices; NEMS resonator; electronic circuit; electronic output voltage; electrostatic actuation; feedback circuit; intrinsic nonlinearity; mechanical displacement; monolithically integrated CMOS oscillator design; monolithically integrated NEMS oscillator design; piezoresistive detection; sensor array application; single active transistor; Biosensors; Electrodes; Electronic circuits; Electrostatic actuators; Nanoelectromechanical systems; Oscillators; Piezoresistance; Sensor arrays; Steady-state; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Test Integration and Packaging of MEMS/MOEMS (DTIP), 2010 Symposium on
  • Conference_Location
    Seville
  • Print_ISBN
    978-1-4244-6636-8
  • Electronic_ISBN
    978-2-35500-011-9
  • Type

    conf

  • Filename
    5486524