Influence of PCB and Connections on the Electromagnetic Conducted Emissions for Electric or Hybrid Vehicle Application

This paper presents a fine modeling method for power module used in an Electric or Hybrid Vehicle (EHV) application. A time domain model is developed in order to predict conducted emissions. All parasitic elements of the power components constituting the power module are obtained by modeling, measuring or applying analytical formula. The influence of the Printed Circuit Board (PCB) and the connections of components on conducted emissions levels are shown here. The results obtained by the proposed models are compared with measurements results.