DocumentCode
519563
Title
Defect recognition algorithm based on curvelet moment and support vector machine
Author
Kong, Fanzhi ; Ni, Hongsheng
Author_Institution
Sch. of Electron. Inf. & Autom., Tianjin Univ. of Sci. & Technol., Tianjin, China
Volume
1
fYear
2010
fDate
17-18 April 2010
Firstpage
142
Lastpage
145
Abstract
In this paper, a new recognition algorithm based on curvelet moment and support vector machine(SVM) is proposed for chip defect recognition. The proposed recognition method is implemented through a reference comparison method. First the defect regions of chips are extracted through preprocessing, and then the curvelet moment feature of the defect region is computed as the input of SVM classifier, the output of the trained SVM classifier is the result of defect recognition. The algorithm combines the good properties of curvelet moment and SVM classifier, the former can provide multi-scale, local details and orientation information of the defect region, and the latter is suitable to solve the small samples, nonlinear and high dimensions pattern recognition problem. Experimental results show that the algorithm has higher recognition rate compared with PCA based method and can solve the complex defects recognition problem effectively.
Keywords
condition monitoring; curvelet transforms; feature extraction; image classification; microprocessor chips; principal component analysis; quality control; support vector machines; PCA based method; SVM classifier; chip defect recognition; curvelet moment feature; defect recognition algorithm; higher recognition rate; pattern recognition problem; reference comparison method; support vector machine; Automation; Character recognition; Electronic mail; Feature extraction; Pattern recognition; Production; Software algorithms; Support vector machine classification; Support vector machines; Testing; curvelet moment; defect recognition; support vector machine;
fLanguage
English
Publisher
ieee
Conference_Titel
E-Health Networking, Digital Ecosystems and Technologies (EDT), 2010 International Conference on
Conference_Location
Shenzhen
Print_ISBN
978-1-4244-5514-0
Type
conf
DOI
10.1109/EDT.2010.5496623
Filename
5496623
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