• DocumentCode
    519781
  • Title

    Comparative analysis of RF wide bandgap technologies for UMTS applications

  • Author

    Sayed, Ahmed ; Sajjad, Ahmed ; Al Tanany, Ahmed ; Bengtsson, Olof ; Boeck, Georg

  • Author_Institution
    Microwave Eng., Berlin Inst. of Technol., Berlin, Germany
  • fYear
    2010
  • fDate
    15-17 March 2010
  • Firstpage
    126
  • Lastpage
    129
  • Abstract
    In this paper, we report the benefits of wide bandgap technology in UMTS applications. For this purpose, three, 10 W, 2.14 GHz class AB power amplifiers based on SiC MESFET and GaN HEMTs have been designed. A model based design procedure with simulated load pull characterization was used and the achieved results of the implemented amplifiers show an excellent performance from the efficiency/ linearity point of view. A small signal gain of 9, 13 and 15 dB for PA1 (SiC MESFET, Cree), PA2 (GaN HEMT, Eudyna) and PA3 (GaN HEMT, Cree), respectively have been obtained. An output power of (40 - 41.5 dBm) and Max. PAE of (43 - 56%) have been achieved, too. Linearity performance based on gain compression, phase distortion, two-tone intercept points and finally ACLR characterization has been done. The results are compared and discussed in detail. It is found that, among state-of-the-art WBG transistor technologies, WBG offers the optimum solution for highly linear, high efficient power amplifiers in wireless communications to date.
  • Keywords
    3G mobile communication; III-V semiconductors; Schottky gate field effect transistors; UHF power amplifiers; gallium compounds; high electron mobility transistors; silicon compounds; wide band gap semiconductors; ACLR characterization; GaN; HEMT; MESFET; RF wide bandgap technologies; SiC; UMTS applications; WBG transistor technologies; class AB power amplifiers; frequency 2.14 GHz; gain 13 dB; gain 15 dB; gain 9 dB; gain compression; high-efficient power amplifiers; linearity performance; phase distortion; power 10 W; two-tone intercept points; wireless communications; 3G mobile communication; Gallium nitride; HEMTs; Linearity; MESFETs; MODFETs; Photonic band gap; Power amplifiers; Radio frequency; Silicon carbide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2010 German
  • Conference_Location
    Berlin
  • Print_ISBN
    978-1-4244-4933-0
  • Electronic_ISBN
    978-3-9812668-1-8
  • Type

    conf

  • Filename
    5498208