Title :
On the magnetic coupling between bondwires in power-transistor packages
Author :
Flucke, Jens ; Schnieder, Frank ; Schmückle, Franz-Josef ; Heinrich, Wolfgang ; Rudolph, Matthias
Author_Institution :
Ferdinand-Braun-Inst. fur Hochstfrequenztechnik (FBH), Berlin, Germany
Abstract :
This paper addresses an important issue regarding power-transistor packages: The mutual inductive coupling of the bondwires. Based on em simulation and analytical parameter extraction, it is shown that the mutual inductances play a key role in determining the packaged transistor performance.
Keywords :
electronics packaging; power transistors; wires (electric); analytical parameter extraction; bondwires; magnetic coupling; mutual inductance; mutual inductive coupling; packaged transistor performance; power-transistor packages; Analytical models; Bonding; Circuit simulation; Equivalent circuits; Microstrip; Mutual coupling; Performance analysis; Scattering parameters; Semiconductor device packaging; Transmission line matrix methods; MODFETs; power transistors; semiconductor device modeling; semiconductor device packaging;
Conference_Titel :
Microwave Conference, 2010 German
Conference_Location :
Berlin
Print_ISBN :
978-1-4244-4933-0
Electronic_ISBN :
978-3-9812668-1-8
