DocumentCode
519790
Title
On the magnetic coupling between bondwires in power-transistor packages
Author
Flucke, Jens ; Schnieder, Frank ; Schmückle, Franz-Josef ; Heinrich, Wolfgang ; Rudolph, Matthias
Author_Institution
Ferdinand-Braun-Inst. fur Hochstfrequenztechnik (FBH), Berlin, Germany
fYear
2010
fDate
15-17 March 2010
Firstpage
90
Lastpage
93
Abstract
This paper addresses an important issue regarding power-transistor packages: The mutual inductive coupling of the bondwires. Based on em simulation and analytical parameter extraction, it is shown that the mutual inductances play a key role in determining the packaged transistor performance.
Keywords
electronics packaging; power transistors; wires (electric); analytical parameter extraction; bondwires; magnetic coupling; mutual inductance; mutual inductive coupling; packaged transistor performance; power-transistor packages; Analytical models; Bonding; Circuit simulation; Equivalent circuits; Microstrip; Mutual coupling; Performance analysis; Scattering parameters; Semiconductor device packaging; Transmission line matrix methods; MODFETs; power transistors; semiconductor device modeling; semiconductor device packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2010 German
Conference_Location
Berlin
Print_ISBN
978-1-4244-4933-0
Electronic_ISBN
978-3-9812668-1-8
Type
conf
Filename
5498223
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