Title :
Broadband microwave circuit interconnection
Author_Institution :
EADS Deutschland GmbH, Ulm, Germany
Abstract :
This paper presents a general design approach for broadband microwave component or circuit. The term broadband here means an operational bandwidth of at least 1,5 - 2 octaves. The paper emphazises the need of compensating bond wire inductivity and how to design appropriate structures to achieve this. The design procedure presented here results from the experience gained during various microwave projects.
Keywords :
microwave circuits; bond wire inductivity; broadband microwave circuit interconnection; operational bandwidth; Bandwidth; Bonding; Impedance; Integrated circuit interconnections; MMICs; Microstrip; Microwave circuits; Printed circuits; Thin film circuits; Wire; bonding wire; compensation; interconnection;
Conference_Titel :
Microwave Conference, 2010 German
Conference_Location :
Berlin
Print_ISBN :
978-1-4244-4933-0
Electronic_ISBN :
978-3-9812668-1-8