DocumentCode
519822
Title
Broadband microwave circuit interconnection
Author
Geist, Thomas
Author_Institution
EADS Deutschland GmbH, Ulm, Germany
fYear
2010
fDate
15-17 March 2010
Firstpage
231
Lastpage
234
Abstract
This paper presents a general design approach for broadband microwave component or circuit. The term broadband here means an operational bandwidth of at least 1,5 - 2 octaves. The paper emphazises the need of compensating bond wire inductivity and how to design appropriate structures to achieve this. The design procedure presented here results from the experience gained during various microwave projects.
Keywords
microwave circuits; bond wire inductivity; broadband microwave circuit interconnection; operational bandwidth; Bandwidth; Bonding; Impedance; Integrated circuit interconnections; MMICs; Microstrip; Microwave circuits; Printed circuits; Thin film circuits; Wire; bonding wire; compensation; interconnection;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference, 2010 German
Conference_Location
Berlin
Print_ISBN
978-1-4244-4933-0
Electronic_ISBN
978-3-9812668-1-8
Type
conf
Filename
5498287
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