DocumentCode :
519822
Title :
Broadband microwave circuit interconnection
Author :
Geist, Thomas
Author_Institution :
EADS Deutschland GmbH, Ulm, Germany
fYear :
2010
fDate :
15-17 March 2010
Firstpage :
231
Lastpage :
234
Abstract :
This paper presents a general design approach for broadband microwave component or circuit. The term broadband here means an operational bandwidth of at least 1,5 - 2 octaves. The paper emphazises the need of compensating bond wire inductivity and how to design appropriate structures to achieve this. The design procedure presented here results from the experience gained during various microwave projects.
Keywords :
microwave circuits; bond wire inductivity; broadband microwave circuit interconnection; operational bandwidth; Bandwidth; Bonding; Impedance; Integrated circuit interconnections; MMICs; Microstrip; Microwave circuits; Printed circuits; Thin film circuits; Wire; bonding wire; compensation; interconnection;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2010 German
Conference_Location :
Berlin
Print_ISBN :
978-1-4244-4933-0
Electronic_ISBN :
978-3-9812668-1-8
Type :
conf
Filename :
5498287
Link To Document :
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