DocumentCode
519990
Title
Measurement of solder ball height and shape defects using a visible supercontinuum based line scan interferometer
Author
Kumar, Malay ; Islam, Mohammed N. ; Terry, Fred L., Jr. ; Davidson, Douglas ; Aleksoff, Carl
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Univ. of Michigan, Ann Arbor, MI, USA
fYear
2010
fDate
16-21 May 2010
Firstpage
1
Lastpage
2
Abstract
We identify shape defects on ~300 μm high solder balls by measuring the 3D profile over +/-20 degrees down the ball surface. A broadband line scan interferometer enables measurement of ball height with 125 nm axial resolution.
Keywords
height measurement; light interferometers; solders; broadband line scan interferometer; shape defects; size 300 mum; solder ball height measurement; solder balls; supercontinuum based line scan interferometer; wavelength 125 nm; Charge coupled devices; Electronics packaging; Inspection; Laser theory; Nonlinear optics; Optical interferometry; Rough surfaces; Semiconductor device measurement; Shape measurement; Surface roughness;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics (CLEO) and Quantum Electronics and Laser Science Conference (QELS), 2010 Conference on
Conference_Location
San Jose, CA
Print_ISBN
978-1-55752-890-2
Electronic_ISBN
978-1-55752-890-2
Type
conf
Filename
5499548
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