DocumentCode
520260
Title
Thickness and refractive index measurement of a wafer based on the optical comb
Author
Jin, Jonghan ; Kim, Jae Wan ; Kim, Jong-Ahn ; Eom, Tae Bong
Author_Institution
Div. of Phys. Metrol., Korea Res. Inst. of Stand. & Sci. (KRISS), Daejeon, South Korea
fYear
2010
fDate
16-21 May 2010
Firstpage
1
Lastpage
2
Abstract
We suggested and demonstrated a novel method that can determine the thickness and refractive index of a wafer at the same time in a single measurement by using the optical comb. The thickness and refractive index of a wafer can be separated simply from optical thickness by using the various phase information obtained in spectral domain. For the feasibility test, the thickness and refractive index of a double side polished wafer were measured.
Keywords
refractive index measurement; thickness measurement; optical comb; wafer refractive index measurement; wafer thickness measurement; Interference; Light sources; Optical feedback; Optical interferometry; Optical modulation; Optical refraction; Optical variables control; Refractive index; Silicon; Thickness measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics (CLEO) and Quantum Electronics and Laser Science Conference (QELS), 2010 Conference on
Conference_Location
San Jose, CA
Print_ISBN
978-1-55752-890-2
Electronic_ISBN
978-1-55752-890-2
Type
conf
Filename
5499829
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