DocumentCode :
52212
Title :
Meeting the Challenge of Multiple Threshold Voltages in Highly Scaled Undoped FinFETs
Author :
Muralidhar, R. ; Jin Cai ; Frank, David J. ; Oldiges, P. ; Lu, Dan ; Lauer, I.
Author_Institution :
Thomas J. Watson Res. Center, IBM, Yorktown Heights, NY, USA
Volume :
60
Issue :
3
fYear :
2013
fDate :
Mar-13
Firstpage :
1276
Lastpage :
1278
Abstract :
Undoped FinFETs are of significant technological interest as they mitigate variation from random discrete dopant effects and provide for density and voltage scaling. A key requirement for undoped FinFETs for VLSI system application is the ability to obtain multiple threshold voltages on chip. This brief discusses options to obtain one logic and one SRAM threshold for both NFETs and PFETs in highly scaled undoped fins and shows that achieving such dual thresholds is challenging and requires new solutions such as more than two metal-gate work functions, dual fin thicknesses, or dual channel materials.
Keywords :
MOSFET; SRAM chips; VLSI; integrated logic circuits; NFET; PFET; SRAM threshold; VLSI system application; density scaling; dual channel material; dual fin thicknesses; highly scaled undoped FinFET; logic threshold; metal-gate work function; multiple threshold voltages; random discrete dopant effects; voltage scaling; Doping; Electrostatics; FinFETs; Logic gates; Random access memory; Silicon germanium; FinFETs; TCAD; multiple device thresholds; short-channel control;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2013.2241767
Filename :
6459575
Link To Document :
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