• DocumentCode
    523075
  • Title

    Advanced thermal sensing circuit and test techniques used in a high performance 65nm processor

  • Author

    Duarte, D.E. ; Taylor, Gareth ; Wong, K.L. ; Mughal, U. ; Geannopoulos, G.

  • Author_Institution
    Technol. & Manuf. Group, Intel Corp., Hillsboro, OR, USA
  • fYear
    2007
  • fDate
    27-29 Aug. 2007
  • Firstpage
    304
  • Lastpage
    309
  • Abstract
    Traditional inaccuracies during manufacturing test of the thermal sensor circuit require excessive guard-bands. These guard-bands increase the chance of unnecessary microprocessor throttling and could introduce a less-than optimum power and thermal design envelope. Circuit techniques that minimize these errors are discussed, including an improved temperature-independent voltage pump, a remote thermal sensing scheme for hot-spot to sensor offset reduction, and a self-heating error calibration method. Experimental data obtained on a high performance 65nm Intel® Pentium® 4 microprocessor demonstrates the feasibility and effectiveness of these techniques, providing a combined potential accuracy improvement of up to 17°C.
  • Keywords
    calibration; microprocessor chips; temperature sensors; thermal management (packaging); Intel Pentium 4 microprocessor; guard band; microprocessor throttling; remote thermal sensing scheme; self heating error calibration method; sensor offset reduction; size 65 nm; temperature independent voltage pump; thermal sensing circuit; thermal sensor circuit testing; Calibration; Circuit testing; Energy consumption; Manufacturing processes; Microprocessors; Sensor systems; Temperature sensors; Thermal management; Thermal sensors; Voltage; analog design; sensor calibration error; temperature sensing; thermal management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Power Electronics and Design (ISLPED), 2007 ACM/IEEE International Symposium on
  • Conference_Location
    Portland, OR
  • Electronic_ISBN
    978-1-59593-709-4
  • Type

    conf

  • DOI
    10.1145/1283780.1283845
  • Filename
    5514306