DocumentCode
523973
Title
Consistent runtime thermal prediction and control through workload phase detection
Author
Cochran, Ryan ; Reda, Sherief
Author_Institution
Div. of Eng., Brown Univ., Providence, RI, USA
fYear
2010
fDate
13-18 June 2010
Firstpage
62
Lastpage
67
Abstract
Elevated temperatures impact the performance, power consumption, and reliability of processors, which rely on integrated thermal sensors to measure runtime thermal behavior. These thermal measurements are typically inputs to a dynamic thermal management system that controls the operating parameters of the processor and cooling system. The ability to predict future thermal behavior allows a thermal management system to optimize a processor´s operation so as to prevent the on-set of high temperatures. In this paper we propose a new thermal prediction method that leads to consistent results between the thermal models used in prediction and observed thermal sensor measurements, and is capable of accurately predicting temperature behavior with heterogenous workload assignment on a multicore platform. We devise an off-line analysis algorithm that learns a set of thermal models as a function of operating frequency and globally defined workload phases. We incorporate these thermal models into a dynamic voltage and frequency scaling (DVFS) technique that limits the maximum temperature during runtime. We demonstrate the effectiveness of our proposed system in predicting the thermal behavior of a real quad-core processor in response to different workloads. In comparison to a reactive thermal management technique, our predictive method dramatically reduces the number of thermal violations, the magnitude of thermal cycles, and workload runtimes.
Keywords
microprocessor chips; temperature sensors; thermal management (packaging); consistent runtime thermal prediction; cooling system; dynamic thermal management system; dynamic voltage scaling; frequency scaling; integrated thermal sensors; power consumption; processor reliability; runtime thermal behavior; thermal control; thermal models; thermal prediction method; workload phase detection; Energy consumption; Frequency; Phase detection; Power measurement; Power system management; Power system reliability; Runtime; Temperature sensors; Thermal management; Thermal sensors; DVFS; multicore systems; proactive control; thermal prediction; thermal sensing; workload phase;
fLanguage
English
Publisher
ieee
Conference_Titel
Design Automation Conference (DAC), 2010 47th ACM/IEEE
Conference_Location
Anaheim, CA
ISSN
0738-100X
Print_ISBN
978-1-4244-6677-1
Type
conf
Filename
5523514
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