DocumentCode
524106
Title
Power delivery for high performance microprocessors
Author
Balasubramanian, S.
Author_Institution
Intel Corp., Bangalore, India
fYear
2008
fDate
11-13 Aug. 2008
Firstpage
239
Lastpage
240
Abstract
Summary form only given. Robust power delivery is considered one the prime challenges in chip design today. As the frequency and complexity of microprocessors increase, the static and dynamic components of power supply noise increase. However, keeping with Moore´s law, the voltage supply to semiconductor chips have been scaling down, thereby reducing margins. There are other challenges including efficiency and power dissipation of the power delivery sub system itself. This presentation will try to discuss these challenges and the solutions employed by the industry to over come of these. The talk will conclude with some discussion on future technologies to improve the overall efficiency of power delivery.
Keywords
integrated circuit design; logic design; microprocessor chips; Moore law; chip design; dynamic component; high performance microprocessor; power delivery; power dissipation; power supply noise; semiconductor chip; static component; voltage supply; Chip scale packaging; Dynamic voltage scaling; Frequency; Microprocessors; Moore´s Law; Noise robustness; Power dissipation; Power supplies; Power system dynamics; Semiconductor device noise; microprocessors; motherboard; power delivery; regulator; supply noise; vrm;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Power Electronics and Design (ISLPED), 2008 ACM/IEEE International Symposium on
Conference_Location
Bangalore
Print_ISBN
978-1-4244-8634-2
Electronic_ISBN
978-1-60558-109-5
Type
conf
DOI
10.1145/1393921.1393985
Filename
5529047
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