• DocumentCode
    524106
  • Title

    Power delivery for high performance microprocessors

  • Author

    Balasubramanian, S.

  • Author_Institution
    Intel Corp., Bangalore, India
  • fYear
    2008
  • fDate
    11-13 Aug. 2008
  • Firstpage
    239
  • Lastpage
    240
  • Abstract
    Summary form only given. Robust power delivery is considered one the prime challenges in chip design today. As the frequency and complexity of microprocessors increase, the static and dynamic components of power supply noise increase. However, keeping with Moore´s law, the voltage supply to semiconductor chips have been scaling down, thereby reducing margins. There are other challenges including efficiency and power dissipation of the power delivery sub system itself. This presentation will try to discuss these challenges and the solutions employed by the industry to over come of these. The talk will conclude with some discussion on future technologies to improve the overall efficiency of power delivery.
  • Keywords
    integrated circuit design; logic design; microprocessor chips; Moore law; chip design; dynamic component; high performance microprocessor; power delivery; power dissipation; power supply noise; semiconductor chip; static component; voltage supply; Chip scale packaging; Dynamic voltage scaling; Frequency; Microprocessors; Moore´s Law; Noise robustness; Power dissipation; Power supplies; Power system dynamics; Semiconductor device noise; microprocessors; motherboard; power delivery; regulator; supply noise; vrm;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Power Electronics and Design (ISLPED), 2008 ACM/IEEE International Symposium on
  • Conference_Location
    Bangalore
  • Print_ISBN
    978-1-4244-8634-2
  • Electronic_ISBN
    978-1-60558-109-5
  • Type

    conf

  • DOI
    10.1145/1393921.1393985
  • Filename
    5529047