DocumentCode
524124
Title
Proactive temperature management in MPSoCs
Author
Coskun, Ayse K. ; Rosing, Tajana Simunic ; Gross, Kenny C.
Author_Institution
Univ. of California, San Diego, CA, USA
fYear
2008
fDate
11-13 Aug. 2008
Firstpage
165
Lastpage
170
Abstract
Preventing thermal hot spots and large temperature variations on the die is critical for addressing the challenges in system reliability, performance, cooling cost and leakage power. Reactive thermal management methods, which take action after temperature reaches a given threshold, maintain the temperature below a critical level at the cost of performance, and do not address the temperature variations. In this work, we propose a proactive thermal management approach, which estimates the future temperature using regression, and allocates workload on a multicore system to reduce and balance the temperature to avoid temperature induced problems. Our technique reduces the hot spots and temperature variations significantly in comparison to reactive strategies.
Keywords
autoregressive moving average processes; multiprocessing systems; regression analysis; system-on-chip; MPSoC; multicore system; multiprocessing system-on-chip; proactive temperature management; reactive thermal management; regression technique; Clocks; Cooling; Costs; Energy management; Permission; Power system management; Power system reliability; Temperature; Thermal degradation; Thermal management; ARMA; multiprocessor; thermal management;
fLanguage
English
Publisher
ieee
Conference_Titel
Low Power Electronics and Design (ISLPED), 2008 ACM/IEEE International Symposium on
Conference_Location
Bangalore
Print_ISBN
978-1-4244-8634-2
Electronic_ISBN
978-1-60558-109-5
Type
conf
DOI
10.1145/1393921.1393966
Filename
5529065
Link To Document