DocumentCode
52438
Title
Thermal Deformation Prediction in Reticles for Extreme Ultraviolet Lithography Based on a Measurement-Dependent Low-Order Model
Author
Bikcora, Can ; Weiland, S. ; Coene, Wim M. J.
Author_Institution
Dept. of Electr. Eng., Eindhoven Univ. of Technol., Eindhoven, Netherlands
Volume
27
Issue
1
fYear
2014
fDate
Feb. 2014
Firstpage
104
Lastpage
117
Abstract
In extreme ultraviolet lithography, imaging errors due to thermal deformation of reticles are becoming progressively intolerable as the source power increases. Despite this trend, such errors can be mitigated by adjusting the wafer and reticle stages based on a set of predicted deformation-induced displacements. Since this control scheme operates online, an accurate low-order model is necessary. However, finite element modeling of the reticle and its adjacent components leads to a large-scale thermo-mechanical model that should be simplified. First, parameters of the model´s initial thermal condition are reduced to only a few from which numerous initial conditions can be accurately reconstructed. This entails placement of temperature sensors at the corresponding locations, and for this purpose, the discrete empirical interpolation method (DEIM) is utilized. Then, linear and nonlinear model reductions are performed via the proper orthogonal decomposition method and DEIM, respectively. The resultant model is employed in the Kalman filter to estimate the parameters of the reticle´s temperature-dependent coefficient of thermal expansion from several displacement measurements and to subsequently predict the displacements that are used for control. By processing the outputs from the simulated large-scale model, this filter is shown to perform successfully, even in the presence of an unexpected initial condition.
Keywords
Kalman filters; finite element analysis; interpolation; reticles; thermal expansion; ultraviolet lithography; DEIM; Kalman filter; adjacent component; deformation induced displacement; discrete empirical interpolation method; displacement measurement; extreme ultraviolet lithography; finite element modeling; large scale thermo-mechanical model; low order model; nonlinear model reduction; orthogonal decomposition method; reticles; temperature dependent coefficient; temperature sensor; thermal deformation prediction; thermal expansion; Clamps; Interpolation; Reduced order systems; Semiconductor device modeling; Temperature sensors; Ultraviolet sources; Vectors; Discrete empirical interpolation method; Kalman filter; extreme ultraviolet lithography; proper orthogonal decomposition; reticle heating; sensor placement;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/TSM.2014.2298360
Filename
6704852
Link To Document