Via interconnection structures for x-band surface mount circulators

Author

Jakab, László ; Hosszú, Sándor ; Berceli, Tibor

Author_Institution

Dept. of Broadband Infocommunications & EM Theor., Budapest Univ. of Technol. & Econ., Budapest, Hungary

fYear

2010

fDate

14-16 June 2010

Firstpage

1

Lastpage

4

Abstract

A method for modeling and designing various via interconnection structures for surface mount circulators is presented. The circulator-via assembly and the interconnection methods are described. The microstrip-via-microstrip structure is divided into parts, each part is treated separately. The background of empirical methods and microwave network theory is shown as a basis of the design steps. Interconnections including single and double vertical via structures are compared by means of the FDTD method. Based on a previously designed X-band circulator, the effects of the via connections on the circulator performance are investigated.

Keywords

Circulators; Electromagnetic scattering; Finite difference methods; Frequency; Integrated circuit interconnections; Microstrip; Microwave devices; Microwave technology; Microwave theory and techniques; Surface-mount technology; SMD circulator; microstrip-via transition;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Radar and Wireless Communications (MIKON), 2010 18th International Conference on

Conference_Location

Vilnius, Lithuania

Print_ISBN

978-1-4244-5288-0

Type

conf

Filename

5540576