DocumentCode
525188
Title
Research on the temperature field of a dry gas seal
Author
Wang Heshun ; Wang Qing ; Zhu Weibing ; Huang Zepei ; Zhang Chening
Author_Institution
Sch. of Mech. Eng. & Autom., Xihua Univ., Chengdu, China
Volume
3
fYear
2010
fDate
25-27 June 2010
Abstract
For further research on temperature field and thermal strain of dry gas seal, numerical simulation is carried out. It is discovered, the temperature of rotating ring declined gradually from inside to outside, maximum temperature (85.45°C) appeared at the inner side of the face, minimum temperature (72.18°C) appeared at the left outside of the ring, with a temperature difference of 13.27°C. The face temperature curve is similar to a parabola; the position maximum temperature appeared is 8.7mm distant from inside, outside of the face has the minimum temperature, with a temperature difference of 3.25°C. By using the material with higher thermal conductivity and controlling the position of face groove, the thermal strain is reduced, gas dynamical reaction and film stiffness is enhanced, thereby, higher stability will be gained.
Keywords
numerical analysis; rings (structures); seals (stoppers); temperature; thermal conductivity; thermal stresses; dry gas seal; face groove; film stiffness; gas dynamical reaction; rotating ring; temperature 72.18 degC; temperature 85.45 degC; temperature field; thermal conductivity; thermal strain; Analytical models; Capacitive sensors; Design automation; Heat engines; Mechanical engineering; Seals; Temperature distribution; Thermal conductivity; Thermal loading; Thermal stability; dry gas seal; numeral calculation; temperature field; thermal strain;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Design and Applications (ICCDA), 2010 International Conference on
Conference_Location
Qinhuangdao
Print_ISBN
978-1-4244-7164-5
Electronic_ISBN
978-1-4244-7164-5
Type
conf
DOI
10.1109/ICCDA.2010.5540774
Filename
5540774
Link To Document