• DocumentCode
    525188
  • Title

    Research on the temperature field of a dry gas seal

  • Author

    Wang Heshun ; Wang Qing ; Zhu Weibing ; Huang Zepei ; Zhang Chening

  • Author_Institution
    Sch. of Mech. Eng. & Autom., Xihua Univ., Chengdu, China
  • Volume
    3
  • fYear
    2010
  • fDate
    25-27 June 2010
  • Abstract
    For further research on temperature field and thermal strain of dry gas seal, numerical simulation is carried out. It is discovered, the temperature of rotating ring declined gradually from inside to outside, maximum temperature (85.45°C) appeared at the inner side of the face, minimum temperature (72.18°C) appeared at the left outside of the ring, with a temperature difference of 13.27°C. The face temperature curve is similar to a parabola; the position maximum temperature appeared is 8.7mm distant from inside, outside of the face has the minimum temperature, with a temperature difference of 3.25°C. By using the material with higher thermal conductivity and controlling the position of face groove, the thermal strain is reduced, gas dynamical reaction and film stiffness is enhanced, thereby, higher stability will be gained.
  • Keywords
    numerical analysis; rings (structures); seals (stoppers); temperature; thermal conductivity; thermal stresses; dry gas seal; face groove; film stiffness; gas dynamical reaction; rotating ring; temperature 72.18 degC; temperature 85.45 degC; temperature field; thermal conductivity; thermal strain; Analytical models; Capacitive sensors; Design automation; Heat engines; Mechanical engineering; Seals; Temperature distribution; Thermal conductivity; Thermal loading; Thermal stability; dry gas seal; numeral calculation; temperature field; thermal strain;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design and Applications (ICCDA), 2010 International Conference on
  • Conference_Location
    Qinhuangdao
  • Print_ISBN
    978-1-4244-7164-5
  • Electronic_ISBN
    978-1-4244-7164-5
  • Type

    conf

  • DOI
    10.1109/ICCDA.2010.5540774
  • Filename
    5540774