DocumentCode :
525860
Title :
Self-protected GaN power devices with reverse drain blocking and forward current limiting capabilities
Author :
Zhou, Chunhua ; Chen, Wanjun ; Piner, Edwin L. ; Chen, Kevin J.
Author_Institution :
Dept. of Electron. & Comput. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
fYear :
2010
fDate :
6-10 June 2010
Firstpage :
343
Lastpage :
346
Abstract :
Self-protected GaN power devices were realized using AlGaN/GaN-on-Si platform, where two built-in intelligent functions were demonstrated for “Smart Discrete” applications. First, an AlGaN/GaN normally-off high electron mobility transistor (HEMT) with reverse drain blocking capability was realized, featuring a Schottky contact controlled drain barrier. Compared to the Schottky drain structures, the new design exhibits only a 0.55 V onset voltage in the forward biased “ON” state, while effectively blocks the reverse current conduction. The device fabrication is also free of extra photomask and process steps. Second, an AlGaN/GaN lateral field-effect rectifier (L-FER) with intrinsic “ON” state current limiting capability was fabricated, featuring a depletion-mode (D-mode) Schottky controlled depletion-mode channel extension (length of LD) beyond the ohmic contact at the cathode electrode, where the on-state current of the new rectifiers are self-limited at 4.59 kA/cm2 (LD = 1.3 μm) and 3.56 kA/cm2 (LD = 1.9 μm) at room temperature. The current limiting level shows a negative temperature coefficient (TC) that is desirable for thermal stability.
Keywords :
Schottky barriers; aluminium compounds; current limiters; elemental semiconductors; gallium compounds; high electron mobility transistors; ohmic contacts; power transistors; rectifiers; silicon; thermal stability; wide band gap semiconductors; AlGaN-GaN; AlGaN-GaN lateral field-effect rectifier; HEMT; Schottky contact controlled drain barrier; Schottky drain structures; Si; built-in intelligent functions; cathode electrode; depletion-mode Schottky controlled depletion-mode channel extension; device fabrication; forward biased on state; forward current limiting; intrinsic on state current limiting capability; negative temperature coefficient; normally-off high electron mobility transistor; ohmic contact; onset voltage; photomask; reverse current conduction; reverse drain blocking capability; room temperature; self-protected GaN power devices; smart discrete applications; temperature 293 K to 298 K; thermal stability; Aluminum gallium nitride; Current limiters; Fabrication; Gallium nitride; HEMTs; MODFETs; Rectifiers; Schottky barriers; Temperature control; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices & IC's (ISPSD), 2010 22nd International Symposium on
Conference_Location :
Hiroshima
ISSN :
1943-653X
Print_ISBN :
978-1-4244-7718-0
Electronic_ISBN :
1943-653X
Type :
conf
Filename :
5543868
Link To Document :
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