Title :
Package level integration of a monolithic buck converter power IC and bondwire magnetics
Author :
Jia, Hongwei ; Lu, Jian ; Wang, Xuexin ; Padmanabhan, Karthik ; Shea, Patrick ; Shen, Z. John
Author_Institution :
Sch. of Electr. Eng. & Comput. Sci., Univ. of Central Florida, Orlando, FL, USA
Abstract :
In this paper, we report a concept of integrating a monolithic buck converter power IC with in-package bondwire inductors. The power IC was designed and fabricated with a standard 0.5μm CMOS process. Multi-turn bondwires with and without ferrite epoxy glob cores are used as the filter inductor in the buck converter. A 2.5V/120mA prototype system in package (SiP) buck converter is built to operate at frequencies up to 5MHz. The power level of the prototype buck converter is scalable by increasing the size of the active power switches.
Keywords :
CMOS integrated circuits; power convertors; power integrated circuits; switches; system-in-package; CMOS process; active power switches; bondwire magnetics; current 120 mA; ferrite epoxy glob cores; filter inductor; in-package bondwire inductors; monolithic buck converter power integrated circuit; multiturn bondwires; package level integration; size 0.5 mum; system in package; voltage 2.5 V; Active filters; Bonding; Buck converters; CMOS process; Ferrites; Inductors; Integrated circuit packaging; Magnetic cores; Power integrated circuits; Prototypes;
Conference_Titel :
Power Semiconductor Devices & IC's (ISPSD), 2010 22nd International Symposium on
Conference_Location :
Hiroshima
Print_ISBN :
978-1-4244-7718-0
Electronic_ISBN :
1943-653X
