DocumentCode :
525927
Title :
Breakdown voltage enhancement for GaN high electron mobility transistors
Author :
Xie, Gang ; Zhang, Bo ; Fu, Fred Y. ; Ng, W.T.
Author_Institution :
Edward S. Rogers Sr. Dept. of Electr. & Comput. Eng., Univ. of Toronto, Toronto, ON, Canada
fYear :
2010
fDate :
6-10 June 2010
Firstpage :
237
Lastpage :
240
Abstract :
This paper presents a high voltage AlGaN/GaN HEMTs with remarkable breakdown voltage enhancement by introducing a magnesium doping layer under the 2-DEG channel. The surface electric field is distributed more evenly when compare to a conventional device structure with the same dimensions. This is primarily due to the presence of a charge balanced magnesium doping layer acting as a floating field plate. By optimizing the layer´s length, L and the doping concentration, a breakdown voltage of 900V with specific on resistance of 4mΩ·cm2 was obtained with L = 1.5μm, a peak concentration of 8×1017cm-3 and a drift region length of 10μm. Comparing with previously published breakdown optimization techniques, this work achieved a 100% improvement in specific on-resistance without any area overhead penalty.
Keywords :
aluminium compounds; electric breakdown; gallium compounds; high electron mobility transistors; magnesium; 2-DEG channel; AlGaN-GaN; HEMT; breakdown voltage enhancement; charge balanced magnesium doping layer; floating field plate; high electron mobility transistors; size 1.5 mum; size 10 mum; surface electric field; voltage 900 V; Aluminum gallium nitride; Doping; Electron mobility; Electronic mail; Gallium nitride; HEMTs; MODFETs; Magnesium; Power semiconductor devices; Strontium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices & IC's (ISPSD), 2010 22nd International Symposium on
Conference_Location :
Hiroshima
ISSN :
1943-653X
Print_ISBN :
978-1-4244-7718-0
Electronic_ISBN :
1943-653X
Type :
conf
Filename :
5544035
Link To Document :
بازگشت