• DocumentCode
    526072
  • Title

    A concept of a novel edge termination technique: Junction termination (RJT)

  • Author

    Honda, Shigeto ; Fujii, Ryoich ; Kawakami, Tsuyoshi ; Fujioka, Seiji ; Narazaki, Atsushi ; Motonami, Kaoru

  • Author_Institution
    Power Semicond. Device Dev. Dept., Mitsubishi Electr. Corp., Koshi, Japan
  • fYear
    2010
  • fDate
    6-10 June 2010
  • Firstpage
    111
  • Lastpage
    114
  • Abstract
    This paper presents a novel junction termination technique, named Recess Junction Termination (RJT), for power devices. This new junction termination improves the breakdown voltage of a planar junction by a silicon recess located to create a positive bevel, which reduces the peak of electric field. The RJT can reduce a thermal budget for the RESURF (REduced SURface Field) layer by the silicon recess, and has compatibility with a fine-pitch process due to a planarization process using Chemical Mechanical Polish (CMP) treatments. After numerous simulations to optimize the structure parameters, we have succeeded in obtaining sufficient blocking capabilities of pn-RJT-diodes, the voltage ratings of which are from 75 V to 1700 V.
  • Keywords
    chemical mechanical polishing; power semiconductor diodes; semiconductor device manufacture; RESURF; breakdown voltage improvement; chemical mechanical polish; edge termination technique; power devices; power semiconductor diodes; recess junction termination; reduced surface field; thermal budget; voltage 75 V to 1700 V; Boron; Costs; Fabrication; Planarization; Power engineering and energy; Power semiconductor devices; Silicon; Substrates; Surface treatment; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices & IC's (ISPSD), 2010 22nd International Symposium on
  • Conference_Location
    Hiroshima
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4244-7718-0
  • Electronic_ISBN
    1943-653X
  • Type

    conf

  • Filename
    5544873