DocumentCode :
526072
Title :
A concept of a novel edge termination technique: Junction termination (RJT)
Author :
Honda, Shigeto ; Fujii, Ryoich ; Kawakami, Tsuyoshi ; Fujioka, Seiji ; Narazaki, Atsushi ; Motonami, Kaoru
Author_Institution :
Power Semicond. Device Dev. Dept., Mitsubishi Electr. Corp., Koshi, Japan
fYear :
2010
fDate :
6-10 June 2010
Firstpage :
111
Lastpage :
114
Abstract :
This paper presents a novel junction termination technique, named Recess Junction Termination (RJT), for power devices. This new junction termination improves the breakdown voltage of a planar junction by a silicon recess located to create a positive bevel, which reduces the peak of electric field. The RJT can reduce a thermal budget for the RESURF (REduced SURface Field) layer by the silicon recess, and has compatibility with a fine-pitch process due to a planarization process using Chemical Mechanical Polish (CMP) treatments. After numerous simulations to optimize the structure parameters, we have succeeded in obtaining sufficient blocking capabilities of pn-RJT-diodes, the voltage ratings of which are from 75 V to 1700 V.
Keywords :
chemical mechanical polishing; power semiconductor diodes; semiconductor device manufacture; RESURF; breakdown voltage improvement; chemical mechanical polish; edge termination technique; power devices; power semiconductor diodes; recess junction termination; reduced surface field; thermal budget; voltage 75 V to 1700 V; Boron; Costs; Fabrication; Planarization; Power engineering and energy; Power semiconductor devices; Silicon; Substrates; Surface treatment; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices & IC's (ISPSD), 2010 22nd International Symposium on
Conference_Location :
Hiroshima
ISSN :
1943-653X
Print_ISBN :
978-1-4244-7718-0
Electronic_ISBN :
1943-653X
Type :
conf
Filename :
5544873
Link To Document :
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