Title :
Temperature estimation model and applications to thermal-aware test scheduling
Author :
Bei, Cao ; Liyi, Xiao ; Yongsheng, Wang
Author_Institution :
Microelectron. Center, Harbin Inst. of Technol., Harbin, China
Abstract :
High temperature during system-on-chip (SoC) test often suffers from critical problems such as timing errors, decrease in reliability and even potential damage to chip under test. Thermal-aware test scheduling is an efficient method for ensuring thermal safe during test. The temperature evaluation is a significant research work during thermal-aware test scheduling. A simple and effective temperature estimation model based on numerical heat transfer theory is proposed that no more requires material physical parameters. A thermal-aware test scheduling algorithm based on genetic algorithm (GA) is also presented that evaluate temperature using the proposed temperature model. Experimental results using SoC d695 of ITC´02 benchmarks show that, with this thermal estimation model, the proposed scheme can not only achieve convergence of temperature, but also obtain optimal test application time.
Keywords :
heat transfer; integrated circuit modelling; integrated circuit testing; system-on-chip; ITC´02 benchmarks; SoC d695; chip under test; genetic algorithm; high temperature during system-on-chip SoC test; numerical heat transfer theory; temperature estimation model; thermal estimation model; thermal-aware test scheduling algorithm; timing errors; Genetics; genetic algorithm; system-on-chip; temperature estimation model; thermal-aware test scheduling;
Conference_Titel :
Computer Science and Information Technology (ICCSIT), 2010 3rd IEEE International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-5537-9
DOI :
10.1109/ICCSIT.2010.5565017