DocumentCode :
5269
Title :
Effect of Load Capacitance and Input Transition Time on FinFET Inverter Capacitances
Author :
Pandey, Ashutosh ; Raycha, Swati ; Maheshwaram, Satish ; Manhas, Sanjeev Kumar ; Dasgupta, S. ; Saxena, Alok Kumar ; Anand, B.
Author_Institution :
Dept. of Electron. & Commun. Eng., Indian Inst. of Technol. Roorkee, Roorkee, India
Volume :
61
Issue :
1
fYear :
2014
fDate :
Jan. 2014
Firstpage :
30
Lastpage :
36
Abstract :
FinFETs are poised to replace conventional MOSFETs at sub-22-nm technology nodes mainly due to their relatively planar compatible fabrication process. It is well known that FinFET device parasitics are critical for the propagation delay and power dissipation. However, a quantitative understanding of device parasitics for circuit design is yet to be attained. We report a new extension transistor-induced capacitance shielding (ETICS) phenomenon. In this phenomenon, the FinFET extension region forms a transistor, which shields gate-extension fringing field capacitance. Due to this phenomenon, we observe a strong dependence of effective values of FinFET logic gate capacitances on transition times of their terminal voltages, which is unlike the conventional transistors. We show that delay estimation methods need to be modified considering ETICS for efficient FinFET circuit design.
Keywords :
MOSFET; capacitance; delay estimation; integrated circuit design; logic gates; shielding; ETICS phenomenon; FinFET circuit design; FinFET device parasitics; FinFET extension region; FinFET logic gate capacitances; delay estimation methods; extension transistor-induced capacitance shielding phenomenon; gate-extension fringing field capacitance; planar compatible fabrication process; power dissipation; propagation delay; terminal voltages; transition times; Capacitance; Doping; FinFETs; Inverters; Logic gates; Semiconductor process modeling; FinFET; parasitic capacitance; three-transistor equivalent circuit;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2013.2291013
Filename :
6678089
Link To Document :
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