DocumentCode
527443
Title
Design and fabrication of 2.45G miniaturized band pass filter by LTCC technology
Author
Chen, Daming ; Liu, Yingli ; Li, Yuanxun ; Zhong, Wenguo ; Lu, Dafu
Author_Institution
State Key Lab. of Electron. Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear
2010
fDate
16-19 Aug. 2010
Firstpage
1321
Lastpage
1323
Abstract
With the rapid development of wireless communication systems and personal consumer electronics, it is intensely necessary for RF-products to be more and more multifunctional and miniaturized. The low-temperature co-fired ceramics (LTCC) technology which has 3-D integration capabilities and low cost is usually used to fabricate miniaturized multilayer RF passive components. As one of the most important passive components in RF wireless transceiver system, the band pass filter (BPF) has attracted significant interest in 3-D miniaturized design. [1, 2]. As we known,an excellent BPF must have low pass-band insertion loss and large out-of-band rejection. In this paper, a 2.45G miniaturized band pass filter, which incorporates a feedback capacitor between input and output to realize two finite transmission zero has been optimized by Ansoft HFSS. After the physical model and inner structure of the BPF are established, the samples are fabricated by LTCC technology. Testing results show that the insertion loss is less than 5.2dB and return loss is less than -13dB at the center frequency of 2.6GHz, which agree basically with the simulation results.
Keywords
band-pass filters; radiofrequency filters; transceivers; 2.45G miniaturized band pass filter; 3D integration capabilities; 3D miniaturized design; Ansoft HFSS; RF products; RF wireless transceiver system; feedback capacitor; finite transmission zero; frequency 2.6 GHz; low pass-band insertion loss; miniaturized multilayer RF passive components; personal consumer electronics; temperature cofired ceramics technology; wireless communication systems; Band pass filters; Ceramics; Filtering theory; Insertion loss; Integrated circuit modeling; Prototypes; Radio frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location
Xi´an
Print_ISBN
978-1-4244-8140-8
Type
conf
DOI
10.1109/ICEPT.2010.5582800
Filename
5582800
Link To Document