DocumentCode :
527443
Title :
Design and fabrication of 2.45G miniaturized band pass filter by LTCC technology
Author :
Chen, Daming ; Liu, Yingli ; Li, Yuanxun ; Zhong, Wenguo ; Lu, Dafu
Author_Institution :
State Key Lab. of Electron. Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
fYear :
2010
fDate :
16-19 Aug. 2010
Firstpage :
1321
Lastpage :
1323
Abstract :
With the rapid development of wireless communication systems and personal consumer electronics, it is intensely necessary for RF-products to be more and more multifunctional and miniaturized. The low-temperature co-fired ceramics (LTCC) technology which has 3-D integration capabilities and low cost is usually used to fabricate miniaturized multilayer RF passive components. As one of the most important passive components in RF wireless transceiver system, the band pass filter (BPF) has attracted significant interest in 3-D miniaturized design. [1, 2]. As we known,an excellent BPF must have low pass-band insertion loss and large out-of-band rejection. In this paper, a 2.45G miniaturized band pass filter, which incorporates a feedback capacitor between input and output to realize two finite transmission zero has been optimized by Ansoft HFSS. After the physical model and inner structure of the BPF are established, the samples are fabricated by LTCC technology. Testing results show that the insertion loss is less than 5.2dB and return loss is less than -13dB at the center frequency of 2.6GHz, which agree basically with the simulation results.
Keywords :
band-pass filters; radiofrequency filters; transceivers; 2.45G miniaturized band pass filter; 3D integration capabilities; 3D miniaturized design; Ansoft HFSS; RF products; RF wireless transceiver system; feedback capacitor; finite transmission zero; frequency 2.6 GHz; low pass-band insertion loss; miniaturized multilayer RF passive components; personal consumer electronics; temperature cofired ceramics technology; wireless communication systems; Band pass filters; Ceramics; Filtering theory; Insertion loss; Integrated circuit modeling; Prototypes; Radio frequency;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
Conference_Location :
Xi´an
Print_ISBN :
978-1-4244-8140-8
Type :
conf
DOI :
10.1109/ICEPT.2010.5582800
Filename :
5582800
Link To Document :
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