• DocumentCode
    527443
  • Title

    Design and fabrication of 2.45G miniaturized band pass filter by LTCC technology

  • Author

    Chen, Daming ; Liu, Yingli ; Li, Yuanxun ; Zhong, Wenguo ; Lu, Dafu

  • Author_Institution
    State Key Lab. of Electron. Films & Integrated Devices, Univ. of Electron. Sci. & Technol. of China, Chengdu, China
  • fYear
    2010
  • fDate
    16-19 Aug. 2010
  • Firstpage
    1321
  • Lastpage
    1323
  • Abstract
    With the rapid development of wireless communication systems and personal consumer electronics, it is intensely necessary for RF-products to be more and more multifunctional and miniaturized. The low-temperature co-fired ceramics (LTCC) technology which has 3-D integration capabilities and low cost is usually used to fabricate miniaturized multilayer RF passive components. As one of the most important passive components in RF wireless transceiver system, the band pass filter (BPF) has attracted significant interest in 3-D miniaturized design. [1, 2]. As we known,an excellent BPF must have low pass-band insertion loss and large out-of-band rejection. In this paper, a 2.45G miniaturized band pass filter, which incorporates a feedback capacitor between input and output to realize two finite transmission zero has been optimized by Ansoft HFSS. After the physical model and inner structure of the BPF are established, the samples are fabricated by LTCC technology. Testing results show that the insertion loss is less than 5.2dB and return loss is less than -13dB at the center frequency of 2.6GHz, which agree basically with the simulation results.
  • Keywords
    band-pass filters; radiofrequency filters; transceivers; 2.45G miniaturized band pass filter; 3D integration capabilities; 3D miniaturized design; Ansoft HFSS; RF products; RF wireless transceiver system; feedback capacitor; finite transmission zero; frequency 2.6 GHz; low pass-band insertion loss; miniaturized multilayer RF passive components; personal consumer electronics; temperature cofired ceramics technology; wireless communication systems; Band pass filters; Ceramics; Filtering theory; Insertion loss; Integrated circuit modeling; Prototypes; Radio frequency;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 2010 11th International Conference on
  • Conference_Location
    Xi´an
  • Print_ISBN
    978-1-4244-8140-8
  • Type

    conf

  • DOI
    10.1109/ICEPT.2010.5582800
  • Filename
    5582800