DocumentCode
528066
Title
Fabrication and reliability test of rigid-flexible optical printed circuit boards for mobile devices
Author
Hwang, Sung Hwan ; Lee, Woo Jin ; Lim, Jung Woon ; Rho, Byung Sup
Author_Institution
Korea Photonics Technol. Inst., Gwangju, South Korea
fYear
2010
fDate
5-9 July 2010
Firstpage
256
Lastpage
257
Abstract
A rigid-flexible optical printed circuit board (PCB) is described in fabrication and reliability. The satisfactory reliability results of below 0.5 dB variation are presented for reflow, foldering, and thermal shock test.
Keywords
circuit reliability; flexible electronics; integrated optics; integrated optoelectronics; printed circuit testing; printed circuits; thermal shock; PCB; foldering; mobile devices; reflow; reliability test; rigid-flexible optical printed circuit boards; thermal shock test; Optical device fabrication; Optical films; Optical polymers; Optical receivers; Optical transmitters; Optical waveguides;
fLanguage
English
Publisher
ieee
Conference_Titel
OptoElectronics and Communications Conference (OECC), 2010 15th
Conference_Location
Sapporo
Print_ISBN
978-1-4244-6785-3
Type
conf
Filename
5588015
Link To Document