Title :
Fabrication and reliability test of rigid-flexible optical printed circuit boards for mobile devices
Author :
Hwang, Sung Hwan ; Lee, Woo Jin ; Lim, Jung Woon ; Rho, Byung Sup
Author_Institution :
Korea Photonics Technol. Inst., Gwangju, South Korea
Abstract :
A rigid-flexible optical printed circuit board (PCB) is described in fabrication and reliability. The satisfactory reliability results of below 0.5 dB variation are presented for reflow, foldering, and thermal shock test.
Keywords :
circuit reliability; flexible electronics; integrated optics; integrated optoelectronics; printed circuit testing; printed circuits; thermal shock; PCB; foldering; mobile devices; reflow; reliability test; rigid-flexible optical printed circuit boards; thermal shock test; Optical device fabrication; Optical films; Optical polymers; Optical receivers; Optical transmitters; Optical waveguides;
Conference_Titel :
OptoElectronics and Communications Conference (OECC), 2010 15th
Conference_Location :
Sapporo
Print_ISBN :
978-1-4244-6785-3
