DocumentCode
528108
Title
Electrical packaging characteristics of a 25-Gbit/s low-cost coaxial laser module
Author
Tseng, Pei-Hao ; Shih, Tien-Tsorng ; Chen, Hao-Wei ; Wu, Yaw-Dong ; Cheng, Wood-Hi
Author_Institution
Dept. of Photonics, Nat. Sun Yat-sen Univ., Kaohsiung, Taiwan
fYear
2010
fDate
5-9 July 2010
Firstpage
56
Lastpage
57
Abstract
An equivalent circuit model of a 25-Gbit/s coaxial laser module is built by extracting electrical characteristics of transistor outline (TO)-Can header, bonding wires, and load through ADS software. The frequency response and the eye diagram of the coaxial laser module are simulated under various source impedances.
Keywords
electronics packaging; equivalent circuits; frequency response; semiconductor lasers; Can header; TO-Can header; bit rate 25 Gbit/s; bonding wires; coaxial laser module; electrical packaging; equivalent circuit model; eye diagram; frequency response; transistor outline; Bonding; Impedance; Integrated circuit modeling; Laser modes; Load modeling; Signal analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
OptoElectronics and Communications Conference (OECC), 2010 15th
Conference_Location
Sapporo
Print_ISBN
978-1-4244-6785-3
Type
conf
Filename
5588224
Link To Document