Title :
Optimization of multichip bonding on a SiOB platform for bidirectional optical subassembly using design of experiment
Author :
Lim, Jung Woon ; Hwang, Sung Hwan ; Lee, Woo-Jin ; Kim, Myung Jin ; Kim, Seon Hoon ; Hann, Swook ; Kim, Jong-Sup ; Kim, Boo-Gyoun ; Rho, Byung Sup
Author_Institution :
Korea Photonics Technol. Inst., Gwangju, South Korea
Abstract :
We propose an assembly technique with optimum condition capable of performing high density multichip integration on a silicon optical bench platform using the design of experiment. We integrated the eight chips on a platform for 4 channels arrayed optical subassembly above 2.5Gb/s/ch.
Keywords :
bonding processes; design of experiments; multichip modules; silicon compounds; bidirectional optical subassembly; design of experiment; high density multichip integration; multichip bonding; silicon optical bench platform; Bonding; Optical fibers; Optical films; Optical filters; Optical interferometry; Wavelength division multiplexing;
Conference_Titel :
OptoElectronics and Communications Conference (OECC), 2010 15th
Conference_Location :
Sapporo
Print_ISBN :
978-1-4244-6785-3
